The Dell EMC PowerEdge R760 is a high-performance, versatile 2U dual-socket rack server designed to deliver exceptional compute, memory, storage, and expansion capabilities for demanding enterprise workloads. It is purpose-built for scalable infrastructure environments, covering use cases such as virtualization, databases, AI/ML inference, high-performance computing (HPC), software-defined storage, and data analytics.
The server supports the latest Intel Xeon Scalable processors (including 4th and 5th generation), features a next-generation Smart Flow chassis for optimal cooling, and offers a broad set of storage, I/O, accelerator, and network options. Its modular design and support for high-density configurations allow organizations to tailor the system to evolving performance and capacity needs.
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Component |
Details |
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Form Factor |
2U rackmount, dual-socket server |
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Processors (CPU) |
Up to 2 × Intel Xeon Scalable (4th Gen) or Xeon Scalable / Xeon Max (5th Gen) – Up to 56 cores per CPU (4th Gen) – Up to 64 cores per CPU (5th Gen) |
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Memory |
32 × DDR5 RDIMM slots Supports high-speed memory (up to 4800 MT/s or more depending on CPU generation) Maximum capacity (e.g. up to 8 TB) |
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Storage / Drive Bays |
Front: up to 12 × 3.5″ SAS/SATA or mixed optional Or: up to 24 × 2.5″ SAS/SATA/NVMe Also supports NVMe E3.S form factor drives in appropriate backplane Rear: additional 2–4 × 2.5″ drives depending on configuration |
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Storage Controllers |
Internal options: PERC H965i, H755, H755N, H355, or HBA355i External: HBA355e, PERC H965e Boot optimized: BOSS-N1 (2 × M.2 NVMe SSDs) Software RAID: S160 |
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GPU / Accelerator Support |
Up to 2 double-wide accelerators (e.g. 350 W class) Or up to 6 single-wide cards Supports DPUs / NIC offload via OCP 3.0 slot |
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Networking / NICs |
Integrated LOM: up to 2 × 1 GbE OCP NIC 3.0 options: 1 GbE ×4, 10 GbE, 25 GbE, 100 GbE, 200 GbE Support for MIC (management / DPU) card: 25/100/200 GbE |
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I/O / Expansion Slots |
Multiple Gen4 / Gen5 riser slot options, up to 8 PCIe slots (varies by configuration and CPU) |
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Chassis / Cooling |
Smart Flow airflow design Optimized cooling for high core-count CPUs with air-cooled infrastructure |
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Power Supply Options |
Multiple redundant hot-swappable PSUs (e.g. from ~700 W to >2800 W, Titanium / Platinum efficiency, AC / HVDC / low-voltage options depending on region) |
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Dimensions (H × W × D) |
Approx. 86.8 mm × 482.0 mm × 700.7 mm (excluding bezel/fan handles) |
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Environmental / Operating Conditions |
Operating temperature: ~10–35 °C continuous (altitude up to ~900 m), higher range in limited duty Humidity: non-condensing 8% to ~80% RH Non-operating: –40 °C to 65 °C |
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Security Features |
Silicon root of trust, secure supply chain, firmware integrity, secure boot, role-based access, MFA support |
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Management & Integration |
Full support for Dell’s iDRAC, OpenManage, Lifecycle Controller, monitoring and orchestration services |